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    STIRRI®

    SKU:TF-YMA-005-K

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    Regular price $10.98 USD
    Regular price $12.99 USD Sale price $10.98 USD
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    HydraMA-TF water-soluble resin-based synthetic tacky paste flux (REM1) for high-end soldering lead-free BGA and SMD components. Medium activity with QC-tracer effectively addressing BGA slumping issues. Customers who switch to Hydra-MA don't look back!

    BGA solder sphere slumping is a defect that occurs during the reflow soldering process, where the solder spheres deform and spread out, resulting in poor solder joint formation. This can lead to various issues, including:

    • Poor electrical connection: The spread-out solder spheres may not adequately contact the BGA pads, leading to increased resistance and potential electrical failures.
    • Mechanical weakness: The reduced solder volume can weaken the joint, making it more susceptible to mechanical stress and vibration.
    • Thermal fatigue: The non-ideal solder joint shape can accelerate thermal fatigue, reducing the component's lifespan.

    Several factors can contribute to BGA solder sphere slumping:

    • Excessive reflow temperature: High temperatures can cause the solder spheres to melt excessively, leading to deformation.
    • Insufficient reflow time: If the solder spheres do not have enough time to solidify properly, they can slump as they cool.
    • Poor solder flux/paste quality: Substandard solder paste can have inadequate viscosity, allowing the solder spheres to spread.
    • Component placement accuracy: Inaccurate component placement can lead to uneven solder distribution and increased slumping.
    • PCB design issues: Poor PCB design, such as inadequate thermal vias or insufficient copper thickness, can contribute to slumping.

    To prevent BGA solder sphere slumping, it is essential to:

    • Optimize the reflow profile: Carefully control the temperature and time parameters to ensure proper solder melting and solidification.
    • Use high-quality solder flux/paste: Select a solder paste with appropriate viscosity and thermal properties.
    • Ensure accurate component placement: Employ precise placement equipment and techniques to minimize misalignment.
    • Design for manufacturability: Consider factors like thermal dissipation, component placement density, and solder joint geometry during PCB design.
    • Implement quality control measures: Regularly inspect solder joints for defects and take corrective actions as needed.

    By addressing these factors, manufacturers can minimize BGA solder sphere slumping and improve the reliability of their electronic products.

    Hydra-MA-TF contains QC-Aid™ and is a tradename for OEM 452-TF and otherwise available as untraceable (without QC-Aid™) - OEM-432-TF

    Product Description

    Suitability

    Solder Paste, BGA, SMD components

    Designation

    ROL0 classification - no-clean and not corrosive. Halide-free (<0.05%). Surface insulation resistant. No copper mirror breakthrough. Low electrochemical migration (<1 decade drop)

    Viscosity

    30-50 mPa/s (Malcom @ 10 RPM/25ºC (x 10³mPa/s))

    Disclaimer

    The information contained herein is based on technical data that we believe to be reliable and is intended for use by persons having relevant skills at their own risk. Consumers should make their own tests to determine the suitability of each product for their particular process and take safety measures. Manufacturer/resellers assume no liability for results obtained or damages incurred through the application of the data presented.

    Cleaning "No-Clean"

    “No-clean” indicates cleaning method as defined by IPC standard and does not mean that the flux leaves no residue. No-clean rather means that the flux can be left on PCB for several consecutive SMT assemblies but also won’t cause corrosion if left indefinitely. However, cleaning can be necessary and it is desirable. No-clean fluxes are easily removed using industrial solvents in ultrasonic devices or using commercially available flux residue removers like STIRRI HydraSweep™.

    Dispensing Kit

    This product does not include any Dispensing Kit - a separate purchase! 

    Dispensing Kit is an add-on for manual dispensing, used to create a pressure with a plunger similarly to a medical syringe.

    Air syringes intended for pneumatic dispensing machines use a piston stopper instead of a plunger. Do not remove the piston as it delivers the best seal preventing contact with air!

    Compliance

    This material is certified REACH-compliant - does not use any raw materials from the REACH restricted list of substances of high concern.

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    You are in good hands!

    Made in the USA to the applicable industry standards 100% customer satisfaction guaranteed!

    Liquid-proof the assembly with Nano-Coating - dries in less than 8 seconds

    STIRRI HydraCoat™ is a liquid repellent making PCB liquid proof, instantly improving assembly value!

    With an impressive droplet contact angle of over 113º, this nonconducting solution creates an invisible hydrophobic shield repelling weather, humidity, moisture - coated PCB continues to function even when fully submerged!

    Broadly suited for consumer devices, automotive circuits, urban and landscaping lightning, LED, medical or electronic devices, marine, boating and yachting industries.

    Dry to touch in less than 8 seconds, self cures in 24 hrs or 10 min in 60ºC chamber.

    STIRRI's Conformal nano-coating ensures end-customer satisfaction while virtually eliminating assembly claims due to environmental or consumer liquid damages.

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